بحث بيانات أعضاء هيئة التدريس - جامعة الزقازيق

/ بحث بيانات أعضاء هيئة التدريس - جامعة الزقازيق

عبدالرحمن عبدالله عوض الله

الموقع الشخصى

عبدالرحمن عبدالله عوض الله

الكلية العلوم - القسم الفيزياء

الدرجات العلمية

بكالوريوس فى الفيزياء, -جامعة عين شمس [1972]
بكالوريوس فى الفيزياء, -جامعة عين شمس [1978]
ماجستير فى الفيزياء, -جامعة عين شمس [1982]
دكتوراه فى الفيزياء, -جامعة الزقازيق [1986]

الحالة الوظيفية الحالية :

قائم بالعمل

التدرج الوظيفى الأكاديمى

معيد : 1/5/1978
مدرس مساعد : 26/12/1982
مدرس : 9/7/1986
أستاذ مساعد : 29/3/1994
أستاذ : 17/1/2005
استاذ متفرغ : 9/5/2011

الأبحاث العلمية

1 - Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders (1434).

2 - Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions (1434).

3 - Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters (1434).

4 - Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique (1433).

5 - Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles (1434).

6 - Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance (1434).

7 - Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions (1433).

8 - Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

9 - Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology (1438).

10 - Efect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy (1439).

11 - Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications (1438).

12 - The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (1439).

13 - The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (1439).

14 - Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field (1438).

15 - Impact of permanent magnet stirring on dendrite growth and elastic properties of SneBi alloys revealed by pulse echo overlap method (1439).

16 - Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring (1440).

17 - Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead‑free solder alloys with microalloying of Te and Co (1440).

18 - Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications (1440).

19 - Improvement of strength‑ductility trade‑off in a Sn–0.7Cu–0.2Ni lead‑free solder alloys through Al‑microalloying (1441).

20 - amma ray shielding characteristics of Sn-20Bi and Sn-20Bi-0.4Cu lead-free alloys (1441).

21 - Structure, stability and optical parameters of cobalt zinc borate glasses (1442).

22 - Impact of cobalt ions on the phonon energy and ligand field parameters of some borate glasses (1442).

23 - Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT (1442).

24 - Novel metallic Bi-Pb–Cd-Ag alloys for shielding against neutrons and gamma rays (1443).

25 - Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder (1443).

26 - Environmental influence of high Na2O additions on microstructure and ligand field parameters of Cr3+ inside borosilicate glass (1444).

27 - Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite (1444).

28 - Exceptional strength-ductility synergy of Ni and Co-Mg-La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite (1445).

29 - The linear and nonlinear optical variations in Na2O-rich borosilicate glass doped with constant CrO3 content (1445).

30 - Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te (1445).

المجالات البحثية