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Abdulrahman Abdullah Awadallah

Faculty Science - Department Physics Department

BSc In NULL, [1972]
BSc In NULL, [1978]
MSc In NULL, [1982]
PhD In NULL, [1986]

Academic Jobs

معيد : 1/5/1978
Doctor Assisant : 26/12/1982
Doctor : 9/7/1986
Professor Assisant : 29/3/1994
Professor : 17/1/2005

Publications

1 - Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders (2013).

2 - Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions (2013).

3 - Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters (2013).

4 - Fabrication ofsiliconcarbidereinforcedaluminummatrixnanocomposites and characterizationofitsmechanicalpropertiesusing non-destructivetechnique (2012).

5 - Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles (2013).

6 - Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance (2013).

7 - Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions (2012).

8 - Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

9 - Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for lip chip technology (2017).

10 - Efect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy (2017).

11 - Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications (2017).

12 - The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (2017).

13 - The role of delayed elasticity and stress relaxation in Sn-Bi-Cu leadfree solders solidified under permanent magnet stirring (2017).

14 - Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field (2017).

15 - Impact of permanent magnet stirring on dendrite growth and elastic properties of SneBi alloys revealed by pulse echo overlap method (2018).

16 - Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring (2019).

17 - Viscoplastic characterization and mechanical strength of novel Sn–1.7Ag–0.7Cu lead‑free solder alloys with microalloying of Te and Co (2019).

18 - Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications (2019).

19 - Improvement of strength‑ductility trade‑off in a Sn–0.7Cu–0.2Ni lead‑free solder alloys through Al‑microalloying (2020).

20 - amma ray shielding characteristics of Sn-20Bi and Sn-20Bi-0.4Cu lead-free alloys (2020).

21 - Structure, stability and optical parameters of cobalt zinc borate glasses (2021).

22 - Impact of cobalt ions on the phonon energy and ligand field parameters of some borate glasses (2020).

23 - Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength–ductility synergy through additions of Ni, Te and MWCNT (2021).

24 - Novel metallic Bi-Pb–Cd-Ag alloys for shielding against neutrons and gamma rays (2022).

25 - Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder (2022).

26 - Environmental influence of high Na2O additions on microstructure and ligand field parameters of Cr3+ inside borosilicate glass (2023).

27 - Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3Cu matrix composite (2022).

28 - Exceptional strength-ductility synergy of Ni and Co-Mg-La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite (2023).

29 - The linear and nonlinear optical variations in Na2O-rich borosilicate glass doped with constant CrO3 content (2024).

30 - Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te (2024).

31 - Microstructure, thermal analysis and stress relaxation behavior of Sn-1.5Ag-0.5Cu alloys with multiple strengthening mechanisms (2025).

32 - A novel type of CoSn2@CoZn7 core–shell precipitation-strengthened Sn–6Zn–0.05Fe solder alloy with improved strength–ductility trade-off through Co microalloying (2025).

Research Area