Staff Data Search - جامعة الزقازيق

/ Staff Data Search - جامعة الزقازيق

احمد محمد الطاهر عبدالعال

Personal Website
Curriculum Vitae

Ahmed Mohamed Eltaher Abdulaal

Faculty Science - Department Physics Department
NULL

Scientific degrees

BSc In NULL, [2001]
MSc In NULL, [2009]
(The effect of ions quad parity on some physical properties of Spbnl Alfretat)
PhD In NULL, [2012]
(Add the effect of copper and silver on the thermal and mechanical properties of the alloy welding tin - 5% antimony lead-free)

الحالة الوظيفية الحالية :

معار

Academic Jobs

معيد : 17/12/2002
Doctor Assisant : 26/10/2009
Doctor : 28/2/2012
Professor Assisant : 28/3/2017
Professor : 4/10/2023

Publications

1 - Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters (2013).

2 - Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders (2013).

3 - Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders (2013).

4 - Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder (2013).

5 - Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni (2014).

6 - Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products (2014).

7 - Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly (2014).

8 - Novel symbol-like IMC formation and changes in the electrical, thermal and mechanical properties of Bi doped Sn–2.0Ag–0.7Cu solders (2017).

9 - Viscoplastic characterization of novel (Fe,Co,Te)/Bi containing Sn–3.0Ag–0.7Cu lead‑free solder alloy (2020).

10 - Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method (2020).

11 - Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead‑Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi (2020).

12 - Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field (2021).

13 - The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements (2022).

14 - Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy (2023).

15 - Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy (2023).

16 - Influence of Rotating Magnetic Field (RMF) on Dendrite Growth, Mechanical and Elastic Properties of Sn-Cu-Co Lead-Free Solder Alloy (2023).

Research Area